Experimental Study of Impingement Cooling by Heat Sinks with Thin Longitudinal Fins for LSI Packages.
نویسندگان
چکیده
منابع مشابه
Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sinks
Cooling of electronic chips has become a critical aspect in the development of electronic devices. Overheating may cause the malfunction or damage of electronics. The time needed for heat removal is particularly important in a wide range of electronic systems, such as switching circuits. Thus, it is important to characterize the transient behavior of the system and determine the response. Most ...
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for their time and efforts in reviewing the proposals and dissertations and their helpful advices. My sincere gratitude goes to DARPA and Intel Corporation for their financial support. I would also like to thank the University of Maryland College Park for their financial support in the form of Graduate School Fellowship. I would also like to take this opportunity to express my appreciations and...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B
سال: 1996
ISSN: 0387-5016,1884-8346
DOI: 10.1299/kikaib.62.1557